LG Sends out of Invites for Event on 28 April; G4 Specifications Leak Ahead of Release

South Korean consumer electronics giant LG is reportedly planning to launch the flagship smartphone ― G4 ― next month.

LG has begun sending out media invites for an event scheduled on 28 April in New York, London and Paris. On 29 April, the company will hold another event in its home city, Seoul, South Korea.

Going by the its initiative to host events in top four global metros, LG is certain to unveil a flagship device, which understood to be the LG G4.

Moreover, the invitation (courtesy, CNET) comes with a message ― Save the date (on top-left corner) to "See the Great, Feel the Great" ― almost confirming that the company is ready to unveil new LG G4.

What's interesting is that the invitation comes with an image having leather as background, hinting the new LG G4 may ship with stitched leather-cover, not metal-shell as previously rumoured.

In a related development, LG G4 has been spotted on benchmarking site revealing key specifications of the device ahead of launch.

Phone Arena while sifting through the popular GFX Performance benchmarking database has stumbled on the LG device codenamed F500X, understood to be the G4, being tested on the latest Android 5.1 Lollipop OS.

In the entry, LG G4 is said to sport 5.5-inch QHD (2,560x1,440p) display with 534 ppi (pixels per inch) resolution and inside the hood, it packs 3GB RAM, 32GB inbuilt memory, 15mp camera (with auto-focus, flash support, 4K video recording ) and a 7mp snapper on the front.

The benchmarking site also revealed a surprising fact that LG G4 will house Snapdragon 808 series Hexa-Core SoC (System on Chip) with Adreno 418 graphics engine, not the top-of-the-line 810 series Octa-core processor seen in the company's flagship phablet G Flex 2.

In January, when reports of Samsung ditching Snapdragon 810 for heating issues hit the headlines, the company's vice president, Woo Ram-chan, had claimed that G Flex 2 that houses the same Qualcomm chipset faced no problems during the tests conducted by the company. After the reassurance from the company, many believed, LG to incorporate the same processor in G4 too.

[Read more: G Flex 2 Set for Release Next Week; LG Allays Concerns on Snapdragon 810 SoC Over-Heating Issues]

Now if the LG G4 spotted on the GFX benchmarking site is to be believed, the recurrence of heating issue in 810 might have forced the company to use the more stable 808 chipset.

Or this model ― F500X ― might be a low-end model of LG G4, reported Phone Arena.

Leaked Specifications of LG G4: