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[A Representational image] A man walks past Xiaomi Mi logoREUTERS/JASON LEE/FILES

After months of speculations, Xiaomi has finally announced that the much awaited flagship Mi5 will house Qualcomm's latest chipset.

Company co-founder Liwan Jiang, on Weibo, confirmed that Xiaomi Mi5 will come packed with Snapdragon 820 SoC (System-on-Chip) and the mass production of the device has already commenced in China.

He also revealed that Xiaomi Mi5 will be launched around spring festival, which means fans can witness the device's unveiling on 8 February, the day when the Chinese new year of Monkey begins, reported Android Central.

With this confirmation, Xiaomi becomes world's second smartphone to feature Qualcomm's new processor. Earlier in the day, Qualcomm, while attending CES (Consumer Electronics Show) 2016, Las Vegas, confirmed that China based Letv Le Max Pro was the first Snapdragon 820 based device.

Read more: Key features of Qualcomm Snapdragon 820

Expected features of Xiaomi Mi5:

Besides the Snapdragon 820 CPU, Xiaomi Mi5 will feature 5.2-inch QHD screen, Android Marshmallow OS, 4GB RAM, 20MP primary camera, 8MP front-snapper and a 3030 mAh battery. It is also expected to boast advanced 3D finger-print technology.

With a little over a month left for Xiaomi Mi5's launch, the company is expected to commence teasing the device's features on social media platforms.

Now that t is confirmed that Mi5 will house Snapdragon 820, Xiaomi will certainly reveal few more specs ahead of launch in its bid incite excitement among fans. 

Watch this space for more updates.

Leaked specifications of Xiaomi Mi5:

Model Xiaomi Mi 5
Display 5.2-inch QHD display with 2560x1440p resolution
OS Android 6.0 Marshmallow
Processor Snapdragon 820 series quad-core processor
GPU Adreno 530
RAM 4GB
Storage 32GB/64GB
Camera
  • Main: 20.0-megapixel camera with dual-LED flash, PDAF (Phase Detection Auto Focus)
  • Front: 8.0-megapixel wide-angle camera
Battery 3030 mAh
Network 4G-LTE
Add-ons Advanced 3D finger-print sensor, 3D Touch display sensor, USB Type-C port, Wi-Fi, Bluetooth v4.1