Motorola is taking extreme measures to tackle one of the most pressing problems of high-end smartphones these days, which is overheating. As an earlier report hinted, Moto X 2016 edition will undergo massive redesign, featuring metal and glass construction and will also come with a Qualcomm Snapdragon 820 chipset. This combination raises concerns of heating but it looks like Motorola has it in control.
In a leaked image by a Chinese technology website TechWeb, Motorola's Moto X 2016 edition will feature a heat pipe to overcome the heating issues that may be triggered by Snapdragon 820 chipset. The heat pipe will quickly transfer the heat to the heat sink while utilizing the handset's full potential. Although Qualcomm may have fixed the heating issues, which was a major setback for Snapdragon 810 chipset, in Snapdragon 820 SoC Motorola is playing safe.
With all the redesigning and heat pipe integration, TechWeb has expressed fear that the Moto X 2016 edition will not be too thin, which is a trend followed by all major companies like Samsung, Apple and others.
Heat pipe cooling technology is not entirely new to the market as manufacturers have long adapted the method in PCs and notebook computers to control excessive heat. As GSMArena pointed, Microsoft and Sony have already integrated a similar technology in their respective flagships, Lumia 950 and Xperia Z5 Premium, to overcome the heating problems induced by Snapdragon 820 processor.
Motorola's fourth generation Moto X 2016 smartphone is still months away and leaks are slowly starting to surface as the handset is developing in its early stages. Considering the trend continues, we expect to learn more details but nothing can be either true or false.
Stay tuned for updates.
