LG is working on its next generation flagship smartphone G4. The company is purportedly using some less powerful SoC (System on Chip) instead of the latest Snapdragon 810.
According to a report published in KoreanTimes, LG is probably avoiding the Snapdragon 810 because Qualcomm is yet to address the overheating issue of the SoC model. For solving the issue, LG will feature SnapDragon 808 SoC models.
On the contrary, Qualcomm has refused to respond to the overheating issue.
The SnapDragon 808 SoC features a dual-core ARM Cortex A57 CPU and a Quad-Core A53 CPU while the SnapDragon 810 features eight core CPU. The SnapDragon 808 also features an Adreno 418 GPU and based on 20nm process technology. The chipset supports 64 bit computing and 4G connectivity.
LG has already started sending out invitations for the event to be held on 28 April in New York, London and Paris and the following day in Singapore and Istanbul. The event will mark the international debut of the LG G4.
LG's another flagship smartphone LG G Flex 2, launched at CES this year is up for grab in Asia, Europe and North America. The curved screen smartphone features self-healing capability and comes powered by a SnapDragon 810 SoC.
