Earlier in the week, Qualcomm at CES (Consumer Electronics Show) 2016 announced Letv Le Max Pro as the world's first smartphone to house the company's new Snapdragon 820 SoC (System-on-Chip), but was tight lipped about the device's price and key specifications.
However, technology blog Mobile-Dad has got hold of the spec-sheet of the Letv's flagship device alleged to be of Le Max Pro.
It is learnt that the Letv Le Max Pro will flaunt a metal-clad body on the rear-side and on the front, it sports a mammoth 6.3-inch QHD display with 2560x1440p resolution. Under-the-hood, it features Android Marshmallow OS, 4GB RAM, 64GB inbuilt storage and 21MP primary camera.
Besides boasting Qualcomm's Snapdragon 820 series processor, Letv Le Max Pro is also the first device to house Snapdragon Sense ID 3D finger-print technology. It is the world's first ultrasonic based-biometric security feature, which is said to be more secure compared to rivals Samsung and Apple devices.
Qualcomm claims that Snapdragon Sense ID has the ability to create a highly detailed 3D image of the unique and subtle features of a user's fingerprint by penetrating the outer layers of the skin.
Read more: Salient features of Snapdragon 820 and Sense ID finger-print technology
There is no word on when Letv Le Max will officially be released, but if sources of Mobile-dad are to believed it will cost ¥3500 (around $531/€489/Rs. 35,430).
